Intel TXN22120 Compatible 1G SFP Transceiver Module

Product Highlights

• Compatible alternative to Intel TXN22120
• 1G connectivity at 1.25Gbps
• Optical wavelength: 1310nm
• Specified reach: 10km on SMF
• Duplex LC / SMF interface
• Digital diagnostic monitoring: Supported
• Operating temperature: 0 to 70°C (32 to 158°F)

Specifications

Rack Integration and Service Access

Plan the fiber route before removing connector protection. The patch lead should follow its manager without pulling on the transceiver, while leaving space to release the latch and service adjacent ports. Protect the end face until final connection and avoid tight bends immediately behind warm exhaust air. For this model, the principal parameters are data rate 1.25Gbps, wavelength 1310nm, rated reach 10km on SMF.

Applications and Optical Link Design

Use this module for equipment interconnection over the specified single-mode fiber plant, including enterprise backbone, campus, metro or data-center interconnect links according to its rated distance. Confirm that both ends use the same optical standard and wavelength plan, and allow for connector, splice and patch-panel loss within the stated power budget.

Before deployment, check the host port type, supported data rate and firmware requirements. The 1G interface configuration must match the remote equipment; sharing a SFP housing alone does not make two transceiver types interoperable.

Before commissioning, measure the complete single-mode channel against the stated budget for 10km on SMF. Inspect every Duplex LC connection and record diagnostic power where supported. Both ends must agree on rate, wavelength and optical standard.

Optical Acceptance, Diagnostics and Handling

For this model, the specified transmit-power range is -9.5~-3dBm; receiver sensitivity is < -20dBm. A sound acceptance record includes link state, diagnostic temperature, supply voltage and transmit or receive levels where the host exposes them. Compare the readings with the stated ranges rather than treating any received light as proof of adequate margin. Persistent alarms or borderline values should trigger an end-face and complete-channel inspection. Diagnostic monitoring is listed as Supported. Before every insertion, keep dust caps in place until the patch lead is ready, avoid touching the optical end face and use an appropriate inspection and cleaning procedure. Do not look into an active optical interface.

Quality Assurance and Packaging

Before packing, the module receives interface inspection, identification and link checks. Protective packaging avoids pressure on the connector and latch. Customer references, rack groups and project packing lists can be added for volume orders.

Intel Compatibility and Factory Testing

Factory verification starts with the expected TXN22120 identity and finishes with an operating host link. EEPROM data, diagnostic visibility and the stated optical parameters are assessed together. Equipment model, hardware revision and software release can be reviewed before dispatch where platform behavior is uncertain.

Frequently Asked Questions

Ordering Information

When ordering, specify TXN22120, SFP1G-LX-31, quantity and intended host platform. Project labels can repeat these details for receiving and asset records. Neutral labels, customer packaging and project-specific compatibility review are available on request.

Shipping and Lead Time

Standard configurations normally ship within one to three working days, with production lead times confirmed for larger quantities. International courier, air freight and sea freight are available; customer courier accounts and nominated forwarders are accepted.